Methods and apparatus for dispensing semiconductor processing solutions with multi-syringe fluid delivery systems

ABSTRACT

Methods and apparatus for controllably dispensing photoresist solutions and other fluids in semiconductor manufacturing equipment from an array of syringe-based fluid dispensers. A multi-syringe fluid dispensing system is provided for photoresist coating within a wafer track coating module. The coating module may contain a spin chuck that is positioned within a catch cup. A robotic dispense arm and gripper assembly may be positioned within the coating module for gripping and positioning a fluid syringe. An array of syringes may be stored on a solution tray within the wafer track coating module for holding a plurality of fluid syringes containing photoresist solutions.

FIELD OF THE INVENTION

[0001] The invention relates to apparatus and methods for dispensingfluids used in semiconductor processing. More particularly, theinvention relates to dispensing photoresist and other fluids usingindividual fluid dispensers.

BACKGROUND OF THE INVENTION

[0002] The photolithography process is an important technique used informing selected circuit patterns on a semiconductor wafer. In general,a photoresist film can be deposited onto a substrate wafer during thisprocess and thereafter pattern-exposed to lithographic equipment inorder to transcribe a selected circuit pattern. The photoresist issubsequently developed with a developer solution to obtain a resistpattern corresponding to the transcribed pattern. The developer isintended to remove the relatively more soluble areas of photoresist, andleave behind the remaining patterned image which basically serves as amask for etching multiple semiconductor wafer layers.

[0003] In order to form desired patterns on a substrate, the photoresistis processed during the development step with a solution that is appliedin a highly controlled manner. Photoresist or resist development iscarried out while a semiconductor wafer is rotated at various speeds andstopped intermittently at preselected time intervals for processing. Forexample, the wafer may be rotated while a developing solution isdispensed onto the wafer from the discharge port of a developer nozzle.A developing solution film may be thus formed which is intended to havea relatively uniform thickness across the surface of the wafer. Both thewafer and the developer film formed thereon are held stationarythereafter for a predetermined time interval so that developing solutionremains in intimate contact with the resist-coated wafer in order todevelop a light-exposed latent image thereon. Upon completion of thisstep in the development process, pure water or other rinse solution canbe supplied from a washing liquid supplying nozzle onto the surface ofthe wafer. The pure water or rinse solution may be eventually scatteredoff by rotating the wafer at a relatively high speed to spin dry thesurface of the wafer to complete this stage of wafer processing.

[0004] A variety of photoresist and developer materials are typicallyapplied to the wafer using a spin coating technique. Either aphotoresist or developer solution is sprayed or otherwise applied on thesurface of the wafer and spun on a rotating chuck. The spinning of thewafer distributes the fluid over the surface of the substrate and exertsa shearing force that separates the excess fluid from the wafer therebyproviding a thin layer or coating of photoresist, developer or any othertype of processing solution. It is often desired to produce a highlyuniform layer on the substrate without defects to enable the formationof subsequent layers to be precisely constructed thereon.

[0005] A significant problem associated with conventional solutiondispense apparatus is their failure to prevent the inadvertent drippingof fluids onto processed wafers or substrates which can lead to defects.Following the spin-coating dispense of solutions using conventionalliquid nozzles, residual amounts of fluid such as photoresist are oftenknown to “drip” onto the underlying wafer. Drips of solution may alsoinclude certain added impurities residing on the surface of a nozzlebody which can further contaminate the wafer. The occurrence of dripsmay result in uneven resist coating, developing defects, line widthdefects and shape failures and other undesirable consequences. Whilesome fluid dispense systems today incorporate apparatus such assuck-back valves in an attempt to prevent drips, such equipment tends toadd extra complexity in addressing the problem of fluid dripping. Theeffectiveness of suck-back valves are also limited since the long tubingoften used can be compressed which can cause dripping despite use of thevalves.

[0006] The available equipment and methods used today do not fully meetthe high performance demands required by current processing solutiondispense applications. There is a need for improved processing solutiondispense apparatus and methods which reduce the occurrence of waferdefects and uneven application of a semiconductor processing coatings.

SUMMARY OF THE INVENTION

[0007] The invention herein provides methods and apparatus fordispensing semiconductor processing solutions with an array ofindividual fluid dispensers. It shall be understood that particularfeatures of the described embodiments of the invention herein may beconsidered individually or in combination with other variations andaspects of the invention.

[0008] A preferable embodiment of the invention provides multi-syringephotoresist and fluid delivery systems. A wafer track module may includeone or more dispense arms formed with grippers that are configured tograsp fluid syringes from a syringe tray. Individual syringes containingfixed amounts of prepared fluids may be picked-up by the gripper anddispense arm, and positioned over a wafer for release of its contents.The syringe may be returned and stored in a home position within its ownholder thereafter. The holder may be fluidly connected to a liquidsource to feed-in processing fluids such as resist solution into areservoir or directly into the syringe itself. The multi-syringeconfiguration provided herein avoids the need for suck-back valves andpumps. Moreover, multiple fluids can be delivered onto a substrate witha reduced risk of cross-contamination which would otherwise be presentwith dispense heads having multiple nozzles located on the single head.The multi-syringe embodiments and the methods of their use disclosedherein provide a relatively simple and effective solution in dispensinga variety of processing fluids with reduced dripping.

[0009] Another aspect of the invention provides methods and apparatusfor dispensing fluids within processing modules using dispense arms thatare configured to grasp individual nozzles from an array of fluid lines.Each nozzle from the array may connected to a separate tube that isfluid communication with a variety of liquid sources. The tubes may beinsulated and covered with a thermal heat exchange jacket to maintainthe fluids therein at a selected temperature. The liquid sources mayeach include a syringe pump or series of individually controlled syringepumps to feed fluids through the tubes to be dispensed through selectednozzles. The nozzle may be picked-up by a gripper installed on thedispense arm, positioned over a wafer to direct fluids passingtherethrough following activation of the respective syringe pump, andthen returned to a home position within the array of fluid lines.

[0010] Other goals and advantages of the invention will be furtherappreciated and understood when considered in conjunction with thefollowing description and the accompanying drawings. While the followingdescription may contain specific details describing particularembodiments of the invention, this should not be construed aslimitations to the scope of the invention but rather as anexemplification of preferable embodiments. For each aspect of theinvention, many variations are possible as suggested herein that areknown to those of ordinary skill in the art. Many changes andmodifications may be made within the scope of the invention withoutdeparting from the spirit thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The illustrations included within this specification describeadvantages and features of the invention. It shall be understood thatsimilar or like reference numerals and characters within the figuresdesignate the same or like features of the invention. It should befurther noted that the illustrations provided herein are not necessarilydrawn to scale.

[0012]FIG. 1 is a simplified floor plan layout of a wafer track systemthat includes stacks of various processing modules used forsemiconductor wafer manufacturing.

[0013]FIG. 2 is a top view illustration of a conventional linear andradial arm fluid dispense system within a processing module.

[0014]FIG. 3 illustrates a dual-dispense radial arm assembly within atrack processing module.

[0015]FIG. 4 is a top view of a process module that incorporates a fluiddispense arm with gripper and a multi-syringe tray provided inaccordance with the invention.

[0016]FIG. 5 is a side view illustration of a linear fluid dispense armand gripper for selecting one or more syringes from a tray locatedwithin the process module shown in FIG. 4.

[0017] FIGS. 6A-B are close-up views of fluid dispense syringe nozzlesthat are fluidly connected to liquid source.

[0018]FIG. 7 is an enlarged side view of the dispense arm gripperengaging the plunger and body portions of a fluid dispense syringe.

[0019]FIGS. 8-11 are various illustrations describing yet another aspectof the invention herein that provides fluid dispense systems fordepositing a wide array of processing solutions from an array of fluiddispense lines and nozzles.

[0020]FIG. 12 illustrates an aerodynamic dispense arm that may beselected for use with the methods and apparatus described herein.

[0021] FIGS. 13A-E depict various grippers which may be selected forvarious fluid dispense arms provided herein in accordance with variousaspects of the invention.

DETAILED DESCRIPTION OF THE INVENTION

[0022] The invention herein may be applied to semiconductor processingequipment such as the wafer track system generally described in FIG. 1.The wafer track system may include basically three sections: a cassetteend interface section, a scanner interface section, and a processsection. The cassette end interface section includes apparatus totransfer wafers from cassettes in which they are stored to the tracksystem and, conversely, from the track system back to cassettesfollowing processing. The scanner interface section may be consideredanother transition area that accommodates equipment for transferringwafers between the track system and photolithographic apparatus.Meanwhile, the process section of a wafer track basically includes anumber of wafer processing modules such as resist coating spin modules,bake/chill modules and resist developing spin modules. As shown in thesystem layout of FIG. 1, various process stacks within a wafer track maybe arranged in an organized manner or optimal configuration to realizecertain benefits and wafer handling efficiencies. For example, a numberof process stations may be configured within the process section havingstacks of processing modules for resist coat and develop processes.Stacks of thermal modules may also be included for heating and coolingwafers having heat exchange apparatus such as bake/chill plates. Theprocess stations as shown in FIG. 1 may include a pair of photoresistcoat sections or stacks of processing modules for applying the initialresist coating onto wafers, and a pair of developing sections withmodules for developing a patterned resist-coated wafer. The wafers maybe delivered and transported within the track system between processstations using a series of robotic arms or other wafer handlingapparatus according to a desired program or set of instructions inaccordance with a predetermined order of processing.

[0023] A semiconductor wafer treatment process involves a highlyorganized set of procedures. Wafers can be initially fed into the wafertrack from one or more cassettes stored locally at a cassette endstation. As shown in the floor plan of FIG. 1, a series of wafercassettes can be arranged in a set of four distinct columns supported ona cassette-mounted table. A wafer carrying robot may gain access to adesired cassette in order to transfer wafers from and to selectedprocess modules within the wafer track system in response to commandsreceived from a controller (not shown). Before forming a photoresistfilm layer onto a wafer or substrate, the wafer may be first transferredto a priming module where its surface can be thermally or chemicallytreated to remove the presence of moisture and to assure a hydrophobicsurface. The wafer may then be cooled with thermal devices such as achill plate, and then conveyed to a coating unit where a photoresistpolymer is distributed evenly onto the wafer surface. Thephotoresist-coated wafer may be subsequently transferred to a heatingunit or bake plate in order to heat and convert the photoresist polymerinto a stable film. Upon completion of the heating step, the processedwafer may be cooled and either conveyed to a cassette for storage, or asin many instances, transferred directly to adjoining stepper apparatusthrough a stepper or scanner interface. The photoresist coating or filmon the wafer is then exposed to a circuit pattern by a applicablephotolithographic techniques within the stepper apparatus. Afterexposure of the stable film, the wafer can be transferred back to thetrack system and heated in a bake module to set the circuit pattern ontothe film. The wafer may be then cooled in a chill module, andtransferred to a develop module. In the develop module, a solution isapplied onto the film to develop a portion of the film, and then a rinsesolution is applied thereafter onto the wafer in order to removedeveloper solution from the surface of the wafer. The wafer may bethermally treated in a bake module afterwards, cooled in a chill module,and then returned to a cassette for storage. The fluid dispensingapparatus and methods provided herein in accordance with the inventionmay be applied to many developing systems available today includingthose described herein.

[0024] As shown in FIGS. 2-3, resist coating modules within a wafertrack system may include a variety of fluid dispense arms. Theconfiguration shown in FIG. 2 illustrates a linear resist arm or armthat is capable of linear motion 20 that is movable along a definedX-axis direction. The linear arm 20 may be directed to slide along a setof rails 22 and driven by conventional electrically-actuated motors 24or other drive mechanisms in order to move the arm back and forth alongvarious positions within the module 25. The arm 20 may be alsoconstructed to move in a relatively vertical direction in order tocontrol the distance between the wafer W and the resist solution and/orfluid supply nozzle 26. The linear arm 20 may include two separatenozzles 26 for dispensing fluids such as photoresist and/or rinsesolutions. A nozzle bath 27 may be also provided for preventing thenozzle 26 from drying when resting in a home position as shown.Furthermore, the linear arm 20 may be moved into a dispense positionover a selected region above a wafer W mounted relatively flat onto aspin chuck 28 that is positioned within a cup or containment vessel 29.A variety of one or more fluids may be thus dispensed through thenozzle(s) 26 onto the wafer. Additionally, a radial fluid dispense arm30 may be installed within the module 25 for dispensing various types ofresist or processing solutions. Another bath 37 may be also selected forthe additional nozzle 36 mounted on the radial arm 30 when placed in ahome or stand-by position. The radial arm 30 may be pivotally mountedwithin the resist module 25 in proximity to the spin cup 29 so as toselectively sweep across and above the underlying wafer W horizontallyalong a defined X-Y plane at preselected intervals during resist coatingprocesses such as those described herein. Alternatively, as shown inFIG. 3, a resist coating or processing module 35 may include a pluralityof radial fluid dispense arms 32 each having a nozzle 34 mounted thereonfor directing fluids to be dispensed onto an underlying substrate S suchas a semiconductor wafer. Each radial arm 32 may be mounted onrelatively opposite sides of the spin cup 39, and may have a dedicatednozzle bath 33 when positioned in a home or rest position. At selectedtime intervals during wafer processing, either or both arms 32 may swingout over the substrate S to dispense selected fluids thereon throughnozzles 34 which may be connected to one or more fluid sources. Thefluid dispense arms 32 may be driven and controlled by available drivingmeans 38 as with other fluid dispense arm assemblies described herein.

[0025] A variety of coating processes may be carried out usingconventional apparatus as shown in FIGS. 2 and 3. For example, duringthe resist coating of a wafer or substrate, the wafer may be firstmounted on a spin chuck or platform. A resist coating solution supplynozzle, which may be ordinarily kept in a stand-by or home positionrelatively outside the immediate area of the wafer W, can sweep or scanabove the wafer while supplying photoresist solution. The nozzle maydirect solution over a certain wafer location for a preselected periodof time or after a desired amount of fluid is released. The supplynozzle may be thereafter returned back to a stand-by or home position.After a predetermined amount of time has passed, the coating process isallowed to proceed to substantial completion. However with the type ofprocess equipment used today, the supply nozzle can pass above the waferagain thus posing a substantial risk of resist solution drips fallingonto the already coated wafer. The risk of forming drips is increasedfurther since a relatively significant amount of solution under pressureis often deposited onto a wafer W quickly within a relatively shortamount of time. When resist solution drips onto the wafer, numerousproblems can result including wafer defects, line width defects, shapefailure of the wafer and other undesired wafer characteristics. Theinvention described herein may be applied to such wafer track systemsand resist coating modules to avoid or minimize the aforementionedlimitations during wafer processing. It shall be further understood thatthe description of the invention herein with respect to forming a resistcoating can be similarly applied to the dispense of developer and otherprocessing solutions.

[0026]FIG. 4 illustrates a process module 40 within a wafer track systemthat may be selected to apply coatings or films of various processingsolutions such as photoresist. As shown in this top view of the processmodule 40 taken along a defined X-Y plane, a wafer W or substrate may betransported into the module by a robot arm 42 or transporter and placedonto a spin chuck 44. The spin chuck 44 may be positioned within a catchcup or bowl 46, and may be driven by a motor or a rotary drivingmechanism. The wafer W may be held in place on the spin chuck 44 withconventional vacuum suction equipment or other known alternatives.Furthermore, one or more linear dispense arms may be mounted within themodule 40 to slidably move along an X-axis direction on a guide rail 41mounted along a bottom or sidewall portion of the unit. The dispense arm42 may be constructed with extendible segments A and B to provide atelescopic arm that extends back and forth along a Y-axis direction asillustrated. For either a radial or linear dispense arm design, certainportions A and B of the arm 42 may extend or contract as desired toposition a distally mounted syringe gripper 50 or holder over asubstrate or other desired location in accordance with this aspect ofthe invention. It shall be understood that the syringe grippers hereinmay be mounted onto other types of dispense arms within the moduleincluding pivotable radial arms such as those described in U.S. patentapplication Ser. No. 10/320,994 which is incorporated by referenceherein in its entirety.

[0027] A tray of fluid syringes 48 may be positioned within the processmodule 40 as illustrated in FIG. 4. The fluid syringes 45 may containany variety of desired processing fluids such as resist solution(s) tobe deposited on a wafer or substrate. Each syringe 45 may be housedwithin individual compartments 49 formed in the tray 48 or groupedtogether as desired to dispense similar types of fluid. In addition, thetray 48 or collection of syringes may be slidably mounted onto a traytrack 49 to the sidewall or other portion of the module 40. The mobilityof the syringe tray 48 may assist or reduce the required movement ofdispense arm 42. When a desired syringe from the tray 48 is selected,the dispense arm 42 may move toward the tray so that the gripper 50mounted thereon can be aligned with the desired syringe. In thisembodiment of the invention, there are no processing fluid tubing thatmay impede interaction between the gripper 50 and desired syringes.Either the tray 48 can be fixed in a stationary position or otherwisemove so as to assist in alignment of the gripper 50 with the selectedsyringe. The dispense arm 42 and gripper 50 may grasp the desiredsyringe from the tray 48 and position the syringe over a desiredlocation above a rotating wafer to form a spin-coating. At the desiredlocation and time, the gripper 50 may actuate the syringe to release thecontents therein onto the underlying wafer. By releasing the entirepredetermined amount of fluid in the syringe, the risk of dripping isfurther reduced. Following dispense of the syringe contents, the arm 42may return the syringe back to an appropriate location or home positionwithin the tray 48. The preceding steps may be repeated as desired sothat additional syringes from tray 48 may be selected and similarlydispensed onto the wafer W or substrate.

[0028] The adjustable multi-fluid dispense arrays provided herein mayinclude a plurality of syringes for depositing resist solution(s) andother types of processing fluids used in wafer track modules. Witheither a robotic dispense arm having a fixed or variable length, thetray containing the array of fluid dispense devices may be positioned incloser proximity to the robotic arm. This may reduce the workloadrequired from the dispense arm alone and save time. A variety of knowncontrollers (not shown) may coordinate movement between the arm and thetray so that minimal moves are required by either the arm and/or thefluid dispense tray. The shared workload placed on the dispense arm andtray may in turn provide some time-savings by reducing movement byrobotic dispense arm only. In the event the a dispense arm has a limitedrange of movement within the module, which may be formed with variousdimensions such as an approximately two-foot by two-foot layout, thesyringe tray may also compensate for such limitations and hold a greaternumber of syringes that are accessible to the dispense arm gripper. Theavailability of numerous individual syringes simplifies construction ofthe dispense arm in that no fluid lines or tubes are needed to runthrough the arm. Accordingly, the number of different fluids to bedispensed is not limited to the number of fluid lines that may becarried or contained within the confines of the fluid dispense arm.

[0029]FIG. 5 provides another illustration of the fluid dispense arm andgripper shown in FIG. 4 which is taken along an X-Z plane of the wafertrack module 40. The fluid dispense arm 42 may be positioned andslidably move along the track 41 mounted on the sidewall portion of themodule 40. The gripper 50 mounted on the dispense arm 42 may include asyringe holder 52 that can grab or secure the main body portion 55 of asyringe. In addition, the gripper 50 may be formed with a plunger holder54 to secure the plunger portion 56 of the syringe. The plunger holder54 may move itself or can be mounted to a movable actuating member 51that selectively lifts and lowers the syringe plunger 54 in anup-and-down direction as directed to load and release fluids to bedispensed. The activation of the plunger holder 54 and the generalmovement of the dispense arm 42 can be directed by one or morecontrollers as with other motor driven assemblies in process moduledescribed herein. The dispense arm 42 and gripper 50 may be kept in aninitial ready stand-by position within module 40 adjacent to the catchcup 46. The dispense arm 42 may be directed upon command to retrieve aselected syringe from the tray 48. The selected syringe may be stored ina relatively upright position within a portion of the tray 48 over arespective fluid reservoir 47 which may be shared with other syringes. Aflexible flap covering may cover the fluid reservoir 47 to prevent entryof foreign objects and to readily allow a syringe to be removed andreplaced while standing in an upright position. The fluid reservoir 47may be formed within the tray 48 to hold a selected amount of processingfluid such as resist. The reservoir 47 may be fluidly connected to afeed line 58 which leads to an external fluid source. Additionally, thetray 48 may include a heat exchanger 53 located in relatively closeproximity to the fluid reservoir 47 and/or feed line 58. The heatexchanger can maintain the fluid to be dispensed by the syringe at adesired temperature. A variety of known heat exchange devices such asPeltier elements and thermo-resistors can be selected to obtain adesired fluid temperature. Rather than circulating heat exchange fluidaround relatively long feed lines with conventional nozzle and hoseassemblies, a selected volume of fluid can be cooled or heated asdesired thus providing highly efficient heat exchange with a smallervolume of fluid as required. The syringe tray 48 may include anindividual heat exchanger for each individual syringe reservoirs tomaintain various fluids at different temperatures. Other embodiments ofthe invention provided herein may direct fluids directly into thesyringes stored in the tray without intermediate storage of fluid withina reservoir.

[0030] As shown in FIG. 6A, a fluid dispense syringe 45 may be fluidlyconnected to a liquid source 61. The liquid source 61 may also include aheat exchanger 63 to maintain a stored solution at a desiredtemperature. The liquid source 61 may be connected to a pump 62 whichdraws fluid through a source line 64. The pump 62 may operateindependently or in concert with other pumps which may be selected tofeed fluids into the syringe tray 48 from external fluid sources. Thefluid drawn by the pump 62 may be directed through a syringe line 65 toone or more fluid reservoirs 47 formed in the syringe tray 48.Alternatively, no pump is needed when fluid is fed into the reservoir 47from above with gravity assisted designs or manually poured therein.Multiple syringes may share a common reservoir, or each may receive thesame type of fluid to be dispensed. In another embodiment of theinvention as shown in FIG. 6B, no reservoirs are needed. Fluids from thepump 62 may be sent directly to syringe 45. An opening 67 in the tray 48may allow fluids to be pumped into the syringe 45 through a syringe line65. A series of valves or seals 66 may be selected to form a fluid tightseal with the syringe 45. In yet another embodiment of the invention,disposable single-use syringes may be sealed and stored in the tray 48wherein the syringes already contain a fixed amount of photoresist orprocessing solution to be dispensed and may be discarded after use. Theprocessing solution 61 may be stored until needed and kept at a desiredtemperature by its respective heat exchanger 63. Depending upon thedesired temperature control for dispensed fluids, either or both of theillustrated syringe tray heat exchangers 53A and 53B may be selected andcontrolled by a temperature control 55 for certain applications. Itshall be understood that a plurality of processing solutions may bedispensed which may be connected to one or more combinations of fluidpumps and feed lines leading to the syringe tray.

[0031] The activation of a dispense arm gripper is illustrated in FIG. 7whereby processing solutions are loaded or unloaded into a syringe. Thedispense arm gripper 70 may engage both the plunger portion 76 and bodyportion 77 of a syringe 75. The syringe holder portion 72 of the gripper70 may engage the body portion 77 of the selected syringe, and theplunger holder portion 74 may similarly engage the syringe plunger 76which may be kept in either a loaded or unloaded position (indicated bydashed lines). In a loaded position, the plunger 75 may be alreadyretracted relatively upward and contain a preselected amount of fluidwithin the syringe 75. Meanwhile, in an unloaded position, the syringe75 does not yet contain the desired amount of fluid to be dispensed orhas already dispensed the fluid. When loading the desired fluid, thesyringe holder 72 may securely hold onto the syringe 75 while theplunger holder 74 can lift or retract the plunger 76 to draw fluid intothe syringe from a fluid reservoir. The plunger holder 74 may include anactuating member 71 connected to the dispense arm 78 that moves in andup-and-down manner to load and unload the syringe 75. It shall beunderstood that a variety of syringes and pipettes are available todayincluding those utilized in the biotechnology industry. Depending onactuating mechanism for each of these fluid dispensing devices, adispense arm gripper may be configured to selectively grasp and actuateeach in accordance with the invention. Furthermore, the syringesselected herein may be disposable single-use fluid delivery devices thatare relatively inexpensive and can be discarded after use as opposed tobeing loaded and reused.

[0032] Another aspect of the invention provides various methods ofresist coating a semiconductor wafer substantially without drips withthe apparatus described herein. For example, a resist coating module maybe provided with a dispense arm formed with a distally mounted gripperfor grasping at least one fluid syringe. The dispense arm may beinstructed to select and grasp a desired syringe from a tray within themodule. Afterwards the dispense arm and syringe may be positioned over adesired location within the module such as over a catch cup thatcontains a spinning wafer mounted on a spin chuck. The gripper may thenunload or actuate the syringe by lowering a plunger portion of thesyringe to dispense the contents of the syringe onto the wafer to form aresist coating. The dispense arm may be then instructed to return thesyringe to a compartment within the tray. The compartment may containresist solution so that the syringe can be lowered so as to be able todraw in solution. The dispense arm gripper may be instructed to load orretract the plunger so that the syringe can immediately dispense fluidsagain or kept in a ready stand-by loaded position. It shall beunderstood that the syringes described herein can be formed in varioussizes and contain fluid volumes ranging from approximately 0.5-5.0 cc orgreater.

[0033]FIGS. 8-11 describes yet another embodiment of the invention thatprovides fluid dispense systems using an array of individual fluiddispense lines and nozzles. By offering an array of tray-mounted fluiddispense lines 85 nearby, a dispense arm 82 may individually select eachfluid line as needed rather than containing or transporting all fluidlines each time. The number of fluid lines 85 are typically formed witha three to six-foot length, and different types of processing solutionsto be dispensed, are thus not limited by physical parameters of thedispense arm 82. As shown in FIGS. 8-9, a dispense arm 82 may beconstructed with one or more grippers 90 such as those describedelsewhere herein. A series of one or controllers may position thedispense arm 82 along various regions within the module 80 relative to aspin cup 86 and chuck 84 mounted wafer W or substrate. The dispense armgripper 90 may align with a selected nozzle 95 stored in a bath on atray 88 for dispense of a desired processing solution. The tray 88 maybe slidably mounted on a track 89. The gripper 90 may be formed with oneor more holders 92 and 94 to grasp the selected nozzle 95 if desired asshown in FIG. 10. Another actuating member 101 may be provided to assistin the up-and-down movement of the gripper 90. Each nozzle 95 may beconnected to a feed line 85 housed within individual tubes or thermaljackets 93 wherein each feed line may be connected to an external fluidsource 91 and commercially available syringe pumps 100 (Cavro, Inc., SanJose, Calif.) as illustrated in FIG. 11. A series or bank of fluidsyringe pumps 100, including their respective separate valve mechanisms96, can be independently actuated or regulated by a central controller110 to dispense fluids. Alternatively, passive valves may be selected todirect fluid into and out of the syringe 100. Each tube 93 may containcirculating heat exchange mediums or elements 103 to maintain the feedline 85 and fluid contained therein at a desired temperature or range oftemperatures. The central controller 110 can also regulate thetemperature and also the flow of fluids and cooling and heating mediumwith a variety of valves 102. A combination of one or more syringe pumps100 may be installed along various portions of the fluid lines 85 as isknown in the field to even further reduce the risk of dripping. Thesingle-tube fluid dispensers provided herein can offer highly-controlledfluid release with individual pumps for each nozzle and tube assemblywith a reduced risk of cross-contamination.

[0034] A variety of fluid dispense arms may be selected herein to movegrippers within different locations in the process module. Many wafertrack process modules are provided with desired laminar airflow to carryout extremely exacting procedures in a fluidly stable environment.Conventional fluid dispense arms in wafer track modules generally have alinear hard-edged design and are formed with a simple rectangulardesign, which are hollow to accommodate tubing that feeds into a nozzlemounted on the distal tip of the arm. Dispense arms with a upside down“U”-shaped cross-section are commonly used whereby tubing is tuckedunderneath the arm and situated within the hollow portion of the armhidden from view substantially. The non-aerodynamic edges of a dispensearm can however create turbulent airflow close to a spinning substrate.When the arm is swept close to its surface, the shape of thisconventional arm disrupts airflow adversely affecting even or uniformcoating thickness of materials such as photoresist. Considering thespeed at which certain components with a track module are moving, andthe rates at which fluids are dispensed within the enclosed environment,it is preferable to maintain substantially laminar airflow within themodule.

[0035] In accordance with another aspect of the invention, the fluiddispense arms herein may be configured as an aerodynamic foil as shownin FIG. 12. The aerodynamically constructed fluid dispense arm may beused in a variety of wafer track processing modules such as the resistcoating and developer units. The dispense arm 120 may be tapered andinclude a relatively larger curved side upper portion opposite arelatively smaller curved side lower portion. As with other gripperassemblies 125 herein, a pair of holders 122 and 124 may be mounted on arelatively distal end portion of the dispense arm 120. As with other airfoil designs generally, the fluid dispense arms herein can be formedwith smooth surfaces so as not to adversely affect laminar airflowintended within the module. For certain dispense arms where tubing isnot run through a hollow cavity within the dispense arm, including thoseselected for the multi-fluid dispense syringe or nozzle/tube arraysdescribed herein, the region underneath the arm facing a spinningsurface does not trap air or otherwise disrupt the desired smoothairflow desired in the module. Accordingly, the simplified dispense armdesigns provided herein offer smooth fluid dispensing results that canprovide a more even distribution of fluid and less likelihood of waferdefects.

[0036] The dispense arms provided herein may be configured with a widevariety of grippers such as those shown in FIGS. 13A-E. It shall beunderstood that the term “gripper” as it is used herein shall includeboth active and passive gripping mechanisms. A variety of mechanicallyand magnetically activated grasping assemblies are provided herein toperform active gripping functions. For example, a gripper may includeone or more holder portions to grasp dispense nozzles or syringes from aprocessing fluid or solution tray. The gripper may include two opposingmembers 132 and 134 that can be drawn closer or further apart to graspor release a syringe 130 or nozzle, respectively, as shown in FIGS.13A-C. A series of grooves and slots may be formed on the portions of agripper holder and the plunger or body portions of a syringe 130 hereinwhich slidably engage each other in a complementary manner.Alternatively, as shown in FIG. 13D, a plurality of alternating opposingmembers or finger portions 135 may be mechanically actuated to open andclose. A gripper may also include a magnetically activated plate asshown in FIG. 13E to engage and disengage another plate on a syringe ornozzle. Other embodiments of the invention may also include passivegripping apparatus such as spring activated members that selectivelyhold and release objects upon application of sufficient force.

[0037] While the invention has been described with reference to theaforementioned specification, the descriptions and illustrations of thepreferable embodiments herein are not meant to be construed in alimiting sense. It shall be understood that all aspects of the inventionare not limited to the specific depictions, configurations or relativeproportions set forth herein which depend upon a variety of conditionsand variables. Various modifications in form and detail of theembodiments of the invention, as well as other variations of theinvention, will be apparent to a person skilled in the art uponreference to the present disclosure. It is therefore contemplated thatthe appended claims shall also cover any such modifications, variationsor equivalents.

What is claimed is:
 1. A multi-syringe fluid dispensing system forphotoresist coating comprising: a wafer track coating module containinga spin chuck that is positioned within a catch cup; a dispense arm andgripper assembly for gripping and positioning a fluid syringe within thewafer track coating module; and a solution tray located within the wafertrack coating module for holding a plurality of fluid syringescontaining photoresist solutions.
 2. The multi-syringe fluid dispensingsystem as recited in claim 1, wherein the gripper includes a plungerholder and a syringe body holder for engaging a selected syringe fromthe solution tray
 3. The multi-syringe fluid dispensing system asrecited in claim 2, wherein the selected syringe from the solution trayinclude complementary portions that removably engage the plunger holderand the syringe body holder.
 4. An apparatus for dispensing a pluralityof photoresist solutions comprising: an array of fluid dispensersmounted on a tray within a processing module, wherein each fluiddispenser includes: a nozzle portion formed at a relatively distalregion of the fluid dispenser; a fluid line running along a length ofthe fluid dispenser leading to the nozzle portion; and a thermal jacketsurrounding the fluid line for circulating a heat transfer medium andcontrolling the temperature of fluid within the fluid line; a dispensearm for supporting a mounted gripper that is configured to grip aselected nozzle portion of a selected fluid dispenser, and wherein thedispense arm can direct the selected nozzle portion to a predeterminedlocation within the processing module; a fluid syringe pump assemblyfluidly connected to a photoresist solution source and the fluid line ofthe selected fluid dispenser; and a controller for controlling the fluidsyringe pump assembly and the dispense of fluid from the photoresistsolution source through the selected nozzle portion of the selectedfluid dispenser.
 5. A method for dispensing photoresist in a wafer trackmodule comprising: selecting a coating module within a wafer tracksystem that includes: a dispense arm to support a gripper for engagingand actuating a fluid syringe; and a spin chuck for supporting asemiconductor wafer; storing a fluid syringe that contains a photoresistsolution within the coat module; instructing the dispense arm andgripper to select and removably engage the fluid syringe; directing thedispense arm with the gripper and the fluid syringe to a predeterminedlocation within the coat module over the semiconductor wafer; andinstructing the gripper to actuate the fluid syringe in order todispense the photoresist solution contained therein onto thesemiconductor wafer.
 6. The method as recited in claim 5, furthercomprising the step of: dispensing the photoresist solution onto asubstantially center portion the semiconductor wafer as it is spinning.7. The method as recited in claim 5, further comprising the step of:returning the dispense arm and gripper to a standby position within thecoat module.